Providing materials with thermal resistance properties.
We offer various components compatible with copper-clad laminates (CCL) and flexible copper-clad laminates (FCCL)!
Evonik, as one of the specialty chemical companies, provides a comprehensive solution to accelerate the development of 5G materials. We offer a wide range of materials that are effective in thermal resistance, including "IDISIL," which makes it easier to adjust the CTE of substrates, and "COMPIMIDE," which improves the thermal resistance of substrates. Please feel free to contact us when you need assistance. 【Features】 <COMPIMIDE Bismaleimide> ■ Easy to process (various methods) ■ Maintains mechanical properties even at high temperatures ■ High solvent resistance ■ Excellent performance under high temperature and humidity conditions *For more details, please refer to the PDF document or feel free to contact us.
- Company：エボニック ジャパン
- Price：Other
